The Next Platform·· 3 hours agoSelectedAI score64
Qualcomm Validates HBC Near-Memory Compute Chip, Set to Power Dragonfly AI250 for Datacenter Inference
Qualcomm Has Eyes On The AI Inference Datacenter With HBC And AI250
AI guide
Qualcomm announced that its first-generation HBC (High Bandwidth Compute) chip has completed lab validation, achieving 18x the memory bandwidth of LPDDR and 5x the Tbps/W energy efficiency of HBM4 in testing. The architecture places the compute die directly beneath an LPDDR memory stack, reducing data transfer distances to the micrometer level to tackle the memory wall in AI inference.
Why it matters
By placing compute cores directly beneath the memory stack, Qualcomm seeks to bypass HBM's high cost and power consumption bottlenecks via a near-memory architecture, offering an alternative path for datacenter inference.
Source:The Next Platform · nextplatform.com