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阶跃终端STEPX Neo智能体手机亮相进博会高通展台

1 reports1 reporting sourcesUpdated 17 hours ago

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2026年11月6日,阶跃终端旗下STEPX Neo智能体手机在进博会高通展台首次亮相,展示了软硬模一体化的智能体交互体验。该设备融合了阶跃终端的AI能力与骁龙端侧技术优势。展会现场还同步展出了智能体终端原生开发工具Step Studio。在具体功能演示中,用户可通过个人智能体阶跃Amoo实现优惠查询,还能联动剪映助手生成旅行视频,以及调用携程规划行程。

AI-generated from reports · Updated 8 hours ago

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Nov 6
  1. 量子位
    阶跃终端 STEPX Neo 智能体手机亮相进博会高通展台

    阶跃终端旗下 STEPX Neo 智能体手机在进博会高通展台首次亮相,展示软硬模一体化的智能体交互体验。该设备结合阶跃终端 AI 能力与骁龙端侧优势,同步展出智能体终端原生开发工具 Step Studio。用户可通过个人智能体阶跃 Amoo 实现优惠查询、联动剪映助手生成旅行视频及调用携程规划行程。

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